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3D BGA Reballing Stencil Kit for iPhone X Motherboard

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2400 in stock


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$33.96 $48.50

2400 in stock

3D BGA Reballing Stencil Kit for iPhone X Motherboard
–Adopting high-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.
–It’s easy to scrape tin,and the thickness of steel sheet around the work can reach 0.3mm,high strength, not easy to deform when pressed by hand.
–Positioning slot is made of high temperature resistant synthetic stone.
–Small and portable,it can be magnified under a microscope
Package:
1* 3D BGA Reballing Stencils
Weight 0.1 kg
Dimensions 12 × 5 × 5 cm
Model Number

3D BGA Stencil

Particle Size

1-10μm

Brand Name

MECHANIC

Usage

Repair Tools for iPhone X

Package

1 Positioning Slot + 2 Soldering Net

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