3D BGA Reballing Stencil Kit for iPhone X Motherboard
–Adopting high-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.
–It’s easy to scrape tin,and the thickness of steel sheet around the work can reach 0.3mm,high strength, not easy to deform when pressed by hand.
–Positioning slot is made of high temperature resistant synthetic stone.
–Small and portable,it can be magnified under a microscope
1* 3D BGA Reballing Stencils