A8 A9 A10 A11 CPU Upper And Lower Layer BGA Reballing Stencil

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A8 A9 A10 A11 CPU Upper And Lower Layer BGA Reballing Stencil

1, original three-in-one design, A8 / A9 integrated positioning board can be compatible with the upper CPU, lower layer, one, but when the layered layer to plant a pad, planted on the lower layer of the pad, planting the lower layer of the upper pad;
2, A8/A9 reserved tin ball position, to prevent flattening tin filled solder ball, resulting in continuous tin problem;
3, positioning plate original 4 adjustment stickers, to solve the wind gun when the middle of planting tin network from the drum problem, the improvement of the used master
will feel a very large role;
4, magnetic base plus iron pieces, there is magnetic and magnetic effects increase, the bottom of the role of magnetic resistance, will not suck small screws and other gadgets,
positive magnetic enhancement, planting tin network more tight;
5, double X-shaped groove design ventilation and heat dissipation, with our heat-discharge anti-drum planting tin network just right,
6, rapid positioning, solve the alignment trouble, reduce planting tin alignment time;
7, to prevent shifting, to solve the issue of tin stencil failure when scraping tin
The link it is for different thickness net:0.1mm 0.12mm 0.15mm Net

SKU: AD-6650422 Category:
Model Number

A8 A9 A10 A11

Usage

Commercial Manufacture

Type

Hand Tool Parts

Material

Stainless Steel

is_customized

Yes

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